MECHANIC S1016 11 İN 1 BLADE SET

Description:

Mechanic S1016 CPU BGA chip ultra thin blade set for smartphone PCB mainboard repair, BGA remove tool glue knife disassembly cleaning tool (1pcs handle + 16pcs blades), with the scale on the blades, BGA ultra thin blade set is used to remove IC chip CPU BGA for iPhone Do repair, operate convenient

Blade Features:

Heat treatment specification:

Sample quench: 780-820 ℃, water cooled

Starting temperatures: 1000-1050 ℃, ending temperature 850 ℃

Quenching temperature: 730-760 ℃

Quenching hardness 58HRC

This blade has heat resistance, low temperature, anti-oxidation, corrosion resistance, abrasion resistance, toughness.

Trail UV glue knives list:

1pcs x #0 T S016 handle

1pcs x # MCN-A knives, remove phone IC, Baseband processor

1pcs x # MCN-B knives, trail glue (remove UV glue)

1pcs x # MCN-C, rubber shovel UV glue knife

1pcs x # MCN-D, separate rubber shovel glue knife

1pcs x # MCN-E, remove glue on the edge of place

1pcs x # MCN-F, remove glue on the edge of place (IC)

1pcs x # MCN-G, remove the IC on the motherboard

1pcs x # MCN-H, remove IC

1pcs x # MCN-I, remove 6S power IC

Added: “ZYXWV T” 6 types blades.

Added: # MCN-J, “J” curved blade (cutting knife), pry BGA CPU chip, quick remove A8 A9 A10 CPU

Package list:

1pcs x dual purpose knife handle

16pcs x blades