OSS TEAM W120+ IC Chip Knife Motherboard Remove

OSS TEAM W110+/W120+ IC Chip Knife Motherboard Remove Glue PCB Thin Blade For iPhone A8 A9 A10 CPU RMA Knives ToolProduct Introduction:

With adopted cryogenic treatment technology, the blade with high carbon content becomes solid, resilient, and precise, which is a good choice for you to remove black glue.
Designed in grip-reinforced screw texture, the item can provide friction for you during the glue-removing process, which helps to anti-slip.
The delicate blade can be assembled on both ends of the cold knife optionally. What’s more, it is simple for you to assemble the knife
1.Brand Name: OSS Team
2.Model: W110+/W120+
3.Blade Material: Steel
4. Type: multi knife
Feature:
1. New 27pcs repair blade suitable for use with different types of chip opration.
2.ues this tool to repair BGA chip, it is easy to operate, no drop point, no copper peeling, easy to clean ect.
3. This tool is made thinner than tin point to allow free movement between the chip and the bottom of the board.

Option W120+ IC Chip Knife:
Option1: W110 +
Option2: W120 +

Product Introduction:
1.brand name:OSS TEAM
2.model:W110+/W120+
3.Blade Material: Steel
4.Type:Multi Knife

Feature:
1.news 27pcs repair blade suitable for use with various types of chip opration.
2.ues this tool to repair BGA chip,it is easy to operate,never drop point, not peeling copper,easy to clean ect.
3.this tool has been made thinner than the tin point to allow free movement between the chip and the bottom of the board.